Brent Lunceford

Digital Transformation, Industry 4.0

5G RF Electronics

Phased Array Radar-Network Slicing

Heterogeneous Integration, 2.5/3D-IC

EV Transportation & Mobility

Autonomous Vehicle Control Center

Renewable energy storage

CAD-to-CAM Additive Manufacturing

3D Electronics

Integrated MEMS

Heterogeneous Integration

Silicon and Metal MEMS and Microsystems

EUV lithography | Excimer Ablation

Maskless Lithography and Market Creation

RF and Optical MEMS

Mass Manufacturing of MEMS

Veinous Analysis via Ultrasonic Technology

LIDAR Augmented Reality

RF and Optical MEMS

Mass Manufacturing of MEMS

Wearable Computers & Electronics

IoT in Healthcare

FttH, FttA and Enterprise Wireless Systems

Embedded Technology

Chiplet Architecture

Wafer Bonding

Wafer Level Interposers

Massive parallel computing

High Speed VLSI Signal Integrity

Computer Automated Manufacturing

Rapid Prototyping/Flexible Manufacturing

Programmable MCM, SoC, CSP, SiP

Roll to Roll Manufacturing

SaaS

Cloud Automation

Six Sigma Manufacturing, Toyota Quality Manufacturing

New Product Development

Commercialization of University Developed Technology

Material Sciences

• Global Engagement Chair, IEEE Sensors Council (2019-present)
• Founding Officer and Program Committee Member, IEEE San Francisco Bay Area MEMS and Sensor Chapter, 2014-present, http://sites.ieee.org/scv-mems/
• Founding Chairman, IEEE Central Texas MEMS & Sensors Council Chapter, 2016-present, http://sites.ieee.org/ctx-sensors
• Served as Master of Ceremonies, 2018 IEEE Vision Innovation Challenges Summit-an IEEE Honor Award Ceremony, San Francisco, CA
• Industry Program Chairman and Keynote Speaker, 2018 International GreenTech “Smart City” Conference, April 4-6, 2018, http://ieeegreentech.org
• IEEE Central Texas Executive Committee, 2016-2017  
• Executive Committee member and Steering Officer, IEEE SF Bay Area MEMS & Sensors Council, http://sites.ieee.org/scv-memsInvited 
• Speaker and Panelist, 2017 Biomedical Conference on Biomedical and Health Informatics, Advancement of IoT and Impact on the Future of Healthcare and Wellness, February 2017, https://bhi.embs.org/2017/home/special-sessions/advancement-of-iot-and-impact-on-the-future-of-healthcare-and-wellness/Organizer
• Chair and Invited Panelist - Flexible Printed Sensors & Systems Workshop, joint IEEE-Northeastern University Silicon Valley, October 2016, http://www.northeastern.edu/siliconvalley/events/flexible-printed-fabric-sensors-and-systems/IEEE 
• Organized and Moderated Panel at the “MEMS Standards Workshop – Current Status and Future” San Jose, CA Oct 28, 2015, http://sites.ieee.org/scv-mems/files/2013/09/IEEE-MEMS-Standards-Workshop.pdfSymposium 
• Chair at MEPTEC 1st Annual Internet of Things Symposium, May 2015, http://www.meptec.org/Resources/2015%20IoT%20Symposium%20Proceedings.pdf
• Senior Member, Institute of Electrical and Electronics Engineers (IEEE), Sr. Member
• American Chemical Society, Sr. Member

• Keynote Address: “MEMS in Texas: Disruptive Technologies and 2018 an Expanding Industry in the Lonestar State,” 2018 SEMI Texas Spring Forum, April 20, 2018

• Keynote Address: “Key Technologies Enabling the 4th Industrial Revolution,” International IEEE SmartCities Conference, AT&T Executive Conference Center, University of Texas at Austin, April 5, 2018 

• Invited Speaker, “The Role that Technology Plays in Optimizing Operations and Maximizing Profitability,” Oil & Gas Game Changers Conference, Petroleum Club, Midland, TX, November 2017 

• Invited Speaker, “Evolution of MEMS & Sensors Technology Enabling IoT Strategies,” Internet of Things in Oil and Gas Conference, Houston, TX, September 2017

• Invited Speaker and Panelist, “MEMS, Sensors and IoT-Impact on the Future of Healthcare and Wellness,” International HIMMS Conference on Biomedical and Health-Special Session on IoT in Healthcare, Orlando, FL, February 2017

• Recognized as World Top 50 GreenTech Leaders, by the World Corporate Social Responsibility Congress, 2019 in a ceremony held at Mumbai India
• Served as Master of Ceremonies, IEEE Vision Innovation Challenges Summit-an IEEE Honor Awards Ceremony, Palace Hotel, San Francisco, California, 2018
• Seed investor in Lantha Inc., a spin-out from University of Texas at Austin, Department of Chemistry while serving as Entrepreneurial Advisor at UT Austin Innovation Center, under direction of Dr. Bob Metcalfe, 2015
• IEEE Santa Clara Region Chapter of the Year Award, serving as a founding Officer, 2015 
• Catalyst investor in Pike Powers Lab (Pecan Street Commercialization Lab), renewable energy infrastructure and data analytics, 2015
• 3M Circle of Technical Excellence and Innovation Achievement Award, 2011 (reserved for 0.1% of staff)
• Cypress Semiconductor Author Achievement Award for MEMS Marketing Publications 2005 
• MCC Outstanding Achievement Award for design, facilitation and start-up of MCC Brockton Technology Center-Class 100/1000 Microelectronic Commercialization Center (fab), 1999

PUBLICATIONS

• “New MEMS & Sensors Chapter in Texas,” B. Lunceford, IEEE Consumer Electronics Magazine, 2017.  
• “Le succès des MEMS: Vers une production de masse,” EE Times, December 9, 2003.
• “Mass Manufacturability Will Facilitate Optical MEMS Success,” B. Lunceford, EE Times China, October 2003. (Cypress Semiconductor-Silicon Light Machines)“
• Mass CMOS Manufacturing Will Enable MEMS Success,” B. Lunceford, Electronicca Oggi, July 2003, page 22-23. (Cypress Semiconductor-Silicon Light Machines)“
• Optical MEMS Vendors Wrestle with Manufacturability,” B. Lunceford
• Fibre Systems Europe (feature article), November 2002, volume 6, No. 11, page 18-20. (Cypress Semiconductor-Silicon Light Machines)“
• A high reliability, reworkable, fluorinated poly(phenylene ether ketone) (12F-PEK) coating for MOEMS and optical systems packaging,” R.T. Pike, et al., Harris Corporation-Microsystems Technology Group, 8th International Advanced Packaging Materials Symposium, June 2003. (industry citation)
• “MCC says organic polymer coating could result in reliable bare-die products,” Editor’s Feature Article, EE Times,January 17, 2000.

JOURNALS

• "Rapid laser prototyping of (polyimide) multichip modules", B.D. Lunceford, J.Reed, I.Yee, M.Wang, T.Hirsch, D.Cobb, R.Miracky, Proceedings of SPIE Photonics West '97, vol. 2993, pp 76-81, San Jose, CA, February 1997. (led to $700M maskless lithography market creation, 2017 figure)"
• Synthesis and characterization of new silicon-containing fluoroacrylate monomers and polymers:3", B.D. Lunceford, V. S. Reddy, P.E. Cassidy, J.W. Fitch III, Polymer, 1996, 38(3). 703.
• "Hexafluoroisopropoxy-containing polyesters", V. S. Reddy, B.D. Lunceford, P.E. Cassidy, J.W. Fitch III, Polymer, 1996, 37(21), p. 4873. (commercialized at MCC)"
• Lithiation and Silylation Reactions of 1,3-bis(1,1,1,3,3,3-hexafluoro-2-hydroxy-2-propyl)benzene", J.W. Fitch, B.D. Lunceford, P.E. Cassidy, B.A. Shoulders, Journal of Organometallic Chemistry, 1996. (collaborative with Texas A&M University)

CONFERENCE PROCEEDINGS AND CONFERENCE PRESENTATIONS

• "Thermoelectric MEMS Coolers," J. Reed, B.  Lunceford, D. DeWulf, A. Somadder, C. N. Potter, R. Nelson, C. Hilbert, and U.  Ghoshal, Solid State Sensors and Actuators Conference, June 5 - 8, 2000, Hilton Head, SC. (joint IBM)       
• “Ultra-reliable Chip-on-Board (polymer) Encapsulant”, B. Lunceford, B. Klein, S. Rattan, J. Rice, S. Sommerfeldt, Government Microcircuit Applications Conference (GOMAC), March 2000. (resulted in 3M product portfolio)
• "From NASA to commercialization of Ultra-reliable polymer Encapsulant”, B. Lunceford, B. Klein, S. Rattan, J. Rice, S. Sommerfeldt, 1999 International Mechanical Engineering Congress and Exposition-EEPD Workshop on “Lessons Learned Regarding the Use of Commercial-Off-the-Shelf (COTS) Equipment in Military and Other Harsh Environments,”November 14-19, 1999, Nashville, TN (resulted in 3M product portfolio)
• “Programmable Multichip Packaging for High-g Applications (invited speaker),” B. Lunceford, B. Miracky, 1999 International Mechanical Engineering Congress and Exposition-EEPD Workshop on “Lessons Learned Regarding the Use of Commercial-Off-the-Shelf (COTS) Equipment in Military and Other Harsh Environments,” November 14-19, 1999, Nashville, TN. (invited talk)
• “Customizable Multichip Modules for High-g Telemetry Applications,” B. Lunceford, P. Muller, L. Burke, S. Sommerfeldt, S. Francomacaro, J. Lehtonen, International Telemetery Conference, Las Vegas, NV, October 1999. (joint Army Research Labs, Johns Hopkins University-MCC) (invited talk)
• "Thermoelectric MEMS-based Cooling,” C. Hilbert, J. Reed, B. Lunceford, D. Nelson, K. Hu, International Thermoelectrics Conference, September 1999. (joint IBM-MCC)
• "Thermoelectric MEMS Coolers (Invited paper)," C. Hilbert, R.  Nelson, J. Reed, B. Lunceford, A. Somadder, K. Hu, and U. Ghoshal, Intl. Conf. on Thermoelectrics, August 29 - September 2, 1999, Baltimore, MD. (joint IBM-MCC)        
• "Thermoelectric MEMS Cooler", C. Hilbert, R.  Nelson, J. Reed, B. Lunceford, A. Somadder, K. Hu, and U. Ghoshal, International Cold Electronics (ICE) Conference, October 15-16, 1998, Washington, D.C. (joint IBM-MCC)
• "Thermoelectric MEMS Cooler", C. Hilbert, R.  Nelson, J. Reed, B. Lunceford, A. Somadder, K. Hu, and U. Ghoshal, DARPA/ONR Thermoelectric Workshop, October 14-16, 1998, Herndon, VA.  (joint IBM-MCC)       
• "High Frequency IC to IC signaling on Rapidly Prototyped Flip Chip MCM-D Substrate," J. Reed, G.  Caldwell, M. Wang, T. Hirsch, I. Yee, B. Lunceford, A. Somadder, D. Cobb, and R.  F. Miracky, Multichip Modules and High Density Packaging Conference, April  15, 1998, Denver, CO.         
• "Rapid laser prototyping of (polyimide) multichip modules," J. Reed, I.  Yee, B. Lunceford, M. Wang, T. Hirsch, D. Cobb, G. Caldwell, A. Somadder, and R.  F. Miracky, SPIE Photonics West ‘97,  February 10-14, 1997, San Jose, CA.         
• "Flexible manufacturing of (polyimide) multichip modules for flip chip ICs," J. Reed, I.  Yee, B. Lunceford, M. Wang, T. Hirsch, D. Cobb, G. Caldwell, A. Somadder, and R.  F. Miracky, IEEE Multi-Chip Module Conference, February 4-5, 1997, Santa Cruz, CA.
• "Flexible Manufacturing of MCMs," R. Miracky, I. Yee, J. Reed, B.D. Lunceford, M. Wang, T. Hirsch, D. Cobb, Defense Advanced Research Projects Administration (DARPA) Conference, San Antonio, TX, February 1996.

GRADUATE AND UNDERGRADUATE COLLEGE CONFERENCE ACTIVITIES

• "Fluorinated Aromatic Polyesters," B.D. Lunceford, P.E. Cassidy, J.W. Fitch, D.V. Person, V.S. Reddy, ANTEC Meeting of the Society of Plastics Engineers, San Francisco, CA, May 1994.
• "The Use of Oxazolines in the Preparation of Silylated Aromatic Carboxylic Acids," B.D. Lunceford, J. Person, J.W. Fitch, P.E. Cassidy, 50th ACS Southwest Regional Meeting, Fort Worth, Texas, November 1994.
• "New Monomers and Polymers from 1,3-HFAB," B.D. Lunceford, J.W. Fitch, P.E. Cassidy, V.S. Reddy, 49th ACS Southwest Regional Meeting, Austin, Texas, Oct. 1993.
• "Hexafluoroisopropoxy-Containing Polyester," B.D. Lunceford, P.E. Cassidy, J.W. Fitch, V.S. Reddy, 49th ACS Southwest Regional Meeting, Austin, Texas, Oct. 1993.
• "Silicon-Containing Fluoroacrylate Polymers," P.E. Cassidy, V.S. Reddy, B.D. Lunceford, J.W. Fitch, 49th ACS Southwest Regional Meeting American Chemical Society, Austin, Texas, Oct. 1993.
• "New Difluoroterephthalate Polyesters," D.V. Person, B.D. Lunceford, P.E. Cassidy, J.W. Fitch, 49th ACS Southwest Regional Meeting, Austin, Texas, Oct. 1993.
• "Polyesters from Hexafluoro-2-propanol-Substituted Aromatics," P.E. Cassidy, J.W. Fitch, B.D. Lunceford, 3rd European Technical Symposium on High-Temperature Polymers, Montpellier, France, June 1993.
• "Polymers Derived from Hexafluoroacetone," B.D. Lunceford, P.E. Cassidy, J.W. Fitch, 48th ACS Southwest Regional Meeting, Lubbock, Texas, Oct. 1992.

PATENTS

• Six patents